Researchon Glass/Glass Laser Encapsulation System

Laser packaging equipment has been designed and developed to complete the glass/glass laser bonding that can integrate the functions of visual recognition, visual positioning, PID control of power with path, and X-Y two platform motion control. The positioning erroris 5 μm; laser power jitter is less than 0.2 W; the positioning time is less than 2 s. The instrument can be used in the field of view of anysize rectangular glass wire frame laser packaging, and the results show that the laser packaging system can achieve rapid and efficient packaging.