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RAN Chongsheng, WANG Yan. Research and application of reliability of high thermal conductivity nano-silver adhesive[J]. Journal of Technology, 2023, 23(1): 48-51. DOI: 10.3969/j.issn.2096-3424.2023.01.007
Citation: RAN Chongsheng, WANG Yan. Research and application of reliability of high thermal conductivity nano-silver adhesive[J]. Journal of Technology, 2023, 23(1): 48-51. DOI: 10.3969/j.issn.2096-3424.2023.01.007

Research and application of reliability of high thermal conductivity nano-silver adhesive

  • The reliability study and application of nano-silver adhesives with high thermal conductivity have attracted widespread attention. The recent research on nano-silver adhesive was reviewed, and its preparation, reliability and application were introduced. In addition, the research limitations and future development direction of nano-silver adhesive were summarized, so as to provide some theoretical references for the practical application of nano-silver adhesive with high thermal conductivity.
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